SemiLEDs’ Metal Vertical Photon Light Emitting Diode (MvpLED™) devices fabricated using SemiLEDs’ proprietary and patent pending process technologies, are the next generation of High Brightness LEDs (HBLED) for advanced applications, including solid state lighting. MvpLED™ chips have many excellent properties, including high thermal conductivity, high brightness, and good reliability. The package manufacturers need to be careful in handling to get the best performance from the chips. The MvpLED™ chip can be divided into three parts: a metal alloy substrate, photon injection engine, and photon injecting nozzles. The metal alloy substrate is soft, and the photon injection engine and photon injecting nozzles are fragile. According to the different mechanical properties of these parts, the user should be very careful to prevent large local stress on the chip during the packaging process. If there is any large local stress, it may damage the photons injecting nozzles or the photons injection engine.